Title:
ADHESIVE COMPOSITION, ADHESIVE TAPE, METHOD FOR PROCESSING SEMICONDUCTOR WAFER AND METHOD FOR PRODUCING TSV WAFER
Document Type and Number:
WIPO Patent Application WO/2011/118506
Kind Code:
A1
Abstract:
Disclosed are an adhesive composition having high bond strength as well as being easily detachable and having superior heat resistance, adhesive tape using that adhesive composition as well as a semiconductor wafer treatment method using that adhesive tape and a method for producing a TSV wafer. The adhesive composition contains an adhesive component and a tetrazole compound represented by general formula (1), general formula (2) or general formula (3). In formulas (1) - (3), R1 and R2 represent hydrogen, a hydroxyl group, amino group, C1-7 alkyl group, alkylene group, phenyl group or mercapto group. The C1-7 alkyl group, alkylene group, phenyl group or mercapto group may be substituted.
Inventors:
NOMURA SHIGERU (JP)
SUGITA DAIHEI (JP)
TONEGAWA TORU (JP)
SUGITA DAIHEI (JP)
TONEGAWA TORU (JP)
Application Number:
PCT/JP2011/056460
Publication Date:
September 29, 2011
Filing Date:
March 17, 2011
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
NOMURA SHIGERU (JP)
SUGITA DAIHEI (JP)
TONEGAWA TORU (JP)
NOMURA SHIGERU (JP)
SUGITA DAIHEI (JP)
TONEGAWA TORU (JP)
International Classes:
C09J201/00; C09J7/20; C09J11/06
Foreign References:
| JP2004520667A | 2004-07-08 | |||
| JP2002536527A | 2002-10-29 | |||
| JP2002129113A | 2002-05-09 | |||
| JP2003327922A | 2003-11-19 | |||
| JP2006096860A | 2006-04-13 | |||
| JP2008231235A | 2008-10-02 | |||
| JPH11322900A | 1999-11-26 | |||
| JP2010009052A | 2010-01-14 | |||
| JP2008159998A | 2008-07-10 |
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
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Claims: