ADHESIVE COMPOSITION AND ADHESIVE TAPE - SEKISUI CHEMICAL CO LTD

Title:

ADHESIVE COMPOSITION AND ADHESIVE TAPE

Document Type and Number:

WIPO Patent Application WO/2020/184310

Kind Code:

A1

Abstract:

The present invention makes it possible to provide an adhesive composition capable of suppressing adhesion enhancement even when subjected to a high-temperature heat treatment step while having high adhesive strength at the time of application, and an adhesive tape having an adhesive layer composed of the adhesive composition. The present invention is an adhesive composition that contains an adhesive component and a silicone-based graft copolymer having a functional group capable of crosslinking with the adhesive component.

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JP2706487	INDUSTRIAL APPLICABILITY: Resin composition for fixing unfired ceramics and tape for fixing.

Inventors:

SHIMOJITOSHO AKIRA (JP)
OGATA YUDAI (JP)

Application Number:

PCT/JP2020/009013

Publication Date:

September 17, 2020

Filing Date:

March 04, 2020

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)

International Classes:

C09J201/00; C09J7/38; C09J11/06; C09J151/00; C09J133/06

Domestic Patent References:

WO2019235287A1

2019-12-12

Foreign References:

JP2003073629A	2003-03-12
JPS62288676A	1987-12-15
JP2010132755A	2010-06-17

Attorney, Agent or Firm:

YASUTOMI & ASSOCIATES (JP)

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