ADHESIVE COMPOSITION AND THERMALLY ADHESIVE MEMBER USING SAME

WIPO Patent Application WO/2012/090646

A1

The purpose of the present invention is to provide an adhesive composition that imparts sufficient adhesive strength when used for bonding to a polyolefin resin molded article that bonds poorly with other members. Another purpose of the present invention is to provide an adhesive composition having excellent heat resistance (heat-resistant adhesive properties) and the like in the bonded part of a joined body obtained by joining a polyolefin resin molded article and another member. This adhesive composition contains an organic solvent, a carboxyl group-containing polyolefin resin which is dissolved in this organic solvent and which has a melt flow rate of 5 to 40 g/10 min when measured at 130°C, and a polyfunctional isocyanate compound. This adhesive composition may further contain a carboxyl group-containing polyolefin resin having a melting point of 120 to 170°C.

ITO Takahiro (C/O TOAGOSEI CO. LTD, 2-1-3, Fushiki, Takaoka-sh, Toyama 95, 〒9330195, JP)
伊藤　隆浩 (〒95 富山県高岡市伏木二丁目１番３号　東亞合成株式会社内 Toyama, 〒9330195, JP)
IMAHORI Makoto (C/O TOAGOSEI CO. LTD, 2-1-3, Fushiki, Takaoka-sh, Toyama 95, 〒9330195, JP)

JP2011/077929

July 05, 2012

December 02, 2011

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TOAGOSEI CO., LTD. (1-14-1, Nishi-Shimbashi Minato-k, Tokyo 19, 〒1058419, JP)
東亞合成株式会社 (〒19 東京都港区西新橋一丁目１４番１号 Tokyo, 〒1058419, JP)
ITO Takahiro (C/O TOAGOSEI CO. LTD, 2-1-3, Fushiki, Takaoka-sh, Toyama 95, 〒9330195, JP)
伊藤　隆浩 (〒95 富山県高岡市伏木二丁目１番３号　東亞合成株式会社内 Toyama, 〒9330195, JP)

C09J123/26; B32B15/085; C09J175/04

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