ADHESIVE COMPOSITION, USE THEREOF, CONNECTION STRUCTURE FOR CIRCUIT MEMBERS, AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2011/118719

A1

Disclosed is an adhesive composition for connecting a first circuit member having a first connection terminal on the main surface, and a second circuit member having a second connection terminal on the main surface, wherein the first circuit member and/or the second circuit member are formed from a base material containing a thermoplastic resin having a glass transition temperature of 200°C or less, the first connection terminal and/or the second connection terminal are formed from ITO and/or IZO, the adhesive composition contains a phosphoric acid-containing compound, and a cured product of the adhesive composition has a free phosphoric acid concentration of 100 mass ppm or less.

JP2017189962	DISASSEMBLY STRUCTURE
JP2001311064	BUBBLING RESISTANT THERMOSENSITIVE LABEL AND METHOD FOR MANUFACTURING THE SAME
JPH07228853	ADHESIVE COMPOSITION

IZAWA HIROYUKI (JP)
KATOGI SHIGEKI (JP)

PCT/JP2011/057208

September 29, 2011

March 24, 2011

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HITACHI CHEMICAL CO LTD (JP)
IZAWA HIROYUKI (JP)
KATOGI SHIGEKI (JP)

C09J201/00; C09J4/00; C09J9/02; C09J11/00; H01B1/22; H01B5/16; H01L21/60; H05K3/32

WO2009128530A1

2009-10-22

JP2009277769A	2009-11-26
JP2009277682A	2009-11-26
JP2005120220A	2005-05-12
JP2004043603A	2004-02-12
JPH10313161A	1998-11-24
JP2006257208A	2006-09-28
JP2009074027A	2009-04-09
JP2004043725A	2004-02-12
JP2007258184A	2007-10-04

HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)

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