Title:
ADHESIVE COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/124013
Kind Code:
A1
Abstract:
This adhesive composition comprising a vinyl polymer (A) and an acrylic adhesive polymer syrup (B), wherein the vinyl polymer (A) has a glass transition temperature (Tg) of 30-200°C and a number-average molecular weight of 500-10,000, and the contained amount of the vinyl polymer (A) is 0.5-60 parts by mass with respect to 100 parts by mass of the acrylic adhesive polymer (B). By applying the adhesive composition to a separator and curing the adhesive composition, it is possible to obtain an adhesive layer in which a first Tg which is the glass transition temperature of the entire adhesive layer is -80 to 10°C, and a second Tg which is the glass transition temperature of the adhesive layer as determined by the X-ray photoelectron spectroscopic analysis of the adhesive layer and calculated from a surface portion of the adhesive layer is 40°C or more, and which is higher than the first Tg by 30°C or more.
Inventors:
HASHIMOTO YUSUKE (JP)
NAKAMURA KENICHI (JP)
TAKEYA NOBUYUKI (JP)
NAKAMURA KENICHI (JP)
TAKEYA NOBUYUKI (JP)
Application Number:
PCT/JP2018/043804
Publication Date:
June 27, 2019
Filing Date:
November 28, 2018
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09J133/04; B32B27/00; B32B27/30; C09J4/02; C09J4/06; C09J7/38; C09J11/06; C09J157/00
Domestic Patent References:
WO2012049962A1 | 2012-04-19 |
Foreign References:
JPH06346026A | 1994-12-20 | |||
JPH07173436A | 1995-07-11 | |||
JP2011231319A | 2011-11-17 | |||
JP2011236414A | 2011-11-24 | |||
JP2014051567A | 2014-03-20 | |||
JP2011236413A | 2011-11-24 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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