Title:
ADHESIVE COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/032163
Kind Code:
A1
Abstract:
Provided is an adhesive composition which can join adherends to each other with high strength while making a joined region flexible and maintaining the texture of a material. This adhesive composition comprises a block copolymer including: a polymer block (A) having a glass transition point of 50°C or higher; and a (meth)acrylic polymer block (B) having a glass transition point of 10°C or lower, wherein a storage elastic modulus, at 23°C, of an adhesive layer formed using said adhesive composition is 0.5 MPa or less.
Inventors:
NAKAMURA KENICHI (JP)
TAKEYA NOBUYUKI (JP)
HASHIMOTO YUSUKE (JP)
KAAI MICHIHIRO (JP)
TAKEYA NOBUYUKI (JP)
HASHIMOTO YUSUKE (JP)
KAAI MICHIHIRO (JP)
Application Number:
PCT/JP2019/031330
Publication Date:
February 13, 2020
Filing Date:
August 08, 2019
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09J153/00; A41H43/04; C09J7/38
Domestic Patent References:
WO2008065982A1 | 2008-06-05 |
Foreign References:
JP2014208762A | 2014-11-06 | |||
JP2002241451A | 2002-08-28 | |||
JP2017206677A | 2017-11-24 | |||
JP2012117159A | 2012-06-21 | |||
JPH08120231A | 1996-05-14 |
Attorney, Agent or Firm:
YAMADA, Tsuyoshi (JP)
Download PDF: