Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2010/084722
Kind Code:
A1
Abstract:
Disclosed is an adhesive composition which has excellent adhesion strength, heat resistance and workability, without using halogen. The adhesive composition is suitable for applications in conductive adhesives which are especially suitable for connecting substrates.
Specifically disclosed is an adhesive composition which contains a resin component that is composed of (A) 10-80 parts by weight of a polyamide elastomer, (B) 10-80 parts by weight of a polyurethane elastomer and (C) 10-80 parts by weight of a styrene-isobutylene-styrene copolymer (with the total of (A), (B) and (C) being 100 parts by weight).
Inventors:
KINOSHITA JUNICHI (JP)
TERADA TSUNEHIKO (JP)
TERADA TSUNEHIKO (JP)
Application Number:
PCT/JP2010/000207
Publication Date:
July 29, 2010
Filing Date:
January 15, 2010
Export Citation:
Assignee:
TATSUTA SYSTEM ELECTRONICS CO (JP)
KINOSHITA JUNICHI (JP)
TERADA TSUNEHIKO (JP)
KINOSHITA JUNICHI (JP)
TERADA TSUNEHIKO (JP)
International Classes:
C09J177/00; C09J9/02; C09J11/00; C09J153/00; C09J175/04; H01B1/22; H05K1/14
Domestic Patent References:
WO2005090509A1 | 2005-09-29 |
Foreign References:
JP2008274044A | 2008-11-13 | |||
JP2006152233A | 2006-06-15 | |||
JP2004143219A | 2004-05-20 | |||
JPH04145184A | 1992-05-19 | |||
JPH1153945A | 1999-02-26 |
Attorney, Agent or Firm:
TSUTADA, Akiko et al. (JP)
Shoko Tsutada (JP)
Shoko Tsutada (JP)
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