Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/040438
Kind Code:
A1
Abstract:
Provided is an adhesive composition which can keep high bond strength even under solder reflow conditions or other high-temperature conditions. Further, the adhesive composition can be easily peeled off without doing damage to an adherend, when the adhesive composition has become unnecessary. The adhesive composition comprises a compound that contains an ethylene glycol skeleton and that has cationically polymerizable reactive groups at both terminals, a compound that contains a propylene glycol skeleton and that has cationically polymerizable reactive groups at both terminals, and a cationic photopolymerization initiator.
Inventors:
NOMURA SHIGERU (JP)
Application Number:
PCT/JP2010/066907
Publication Date:
April 07, 2011
Filing Date:
September 29, 2010
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
NOMURA SHIGERU (JP)
NOMURA SHIGERU (JP)
International Classes:
C09J201/02; C09J4/00; C09J11/06; C09J163/00
Foreign References:
| JP2004035866A | 2004-02-05 | |||
| JP2002348558A | 2002-12-04 | |||
| JPH07224270A | 1995-08-22 | |||
| JPH06240225A | 1994-08-30 | |||
| JPH0820762A | 1996-01-23 | |||
| JP2006188586A | 2006-07-20 |
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
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