Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/115697
Kind Code:
A1
Abstract:
The present invention provides an adhesive composition which is useful for bonding low-surface-energy substrates such as polypropylene and which is superior in safety to conventionally known acrylic adhesives for low-surface-energy substrates and needs no primer. The adhesive composition of the present invention comprises a compound having a polymerizable unsaturated group, such as a (meth)acrylic monomer, a reducing agent, and a polyamine, the reducing agent being a carboxylic acid salt of a transition metal and the polyamine being one having at least one tertiary amino group.
Inventors:
IMURA TETSURO (JP)
KOYAMA YUJI (JP)
ENDO TAKESHI (JP)
KOYAMA YUJI (JP)
ENDO TAKESHI (JP)
Application Number:
PCT/JP2016/088030
Publication Date:
July 06, 2017
Filing Date:
December 21, 2016
Export Citation:
Assignee:
SOKEN KAGAKU KK (JP)
International Classes:
C09J4/02; C09J11/06
Domestic Patent References:
| WO2015004175A1 | 2015-01-15 | |||
| WO2013084753A1 | 2013-06-13 | |||
| WO2012073684A1 | 2012-06-07 |
Foreign References:
| JP2009051944A | 2009-03-12 | |||
| JPH1149983A | 1999-02-23 | |||
| JPS54158444A | 1979-12-14 | |||
| JPS5311932A | 1978-02-02 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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