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Patent Searching and Data


Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/115697
Kind Code:
A1
Abstract:
The present invention provides an adhesive composition which is useful for bonding low-surface-energy substrates such as polypropylene and which is superior in safety to conventionally known acrylic adhesives for low-surface-energy substrates and needs no primer. The adhesive composition of the present invention comprises a compound having a polymerizable unsaturated group, such as a (meth)acrylic monomer, a reducing agent, and a polyamine, the reducing agent being a carboxylic acid salt of a transition metal and the polyamine being one having at least one tertiary amino group.

Inventors:
IMURA, Tetsuro (13-1, Hirosehigashi 1-chome, Sayama-sh, Saitama 20, 〒3501320, JP)
KOYAMA, Yuji (13-1, Hirosehigashi 1-chome, Sayama-sh, Saitama 20, 〒3501320, JP)
ENDO, Takeshi (Kinki University 11-6 Kayanomori Iizuka-sh, Fukuoka 55, 〒8208555, JP)
Application Number:
JP2016/088030
Publication Date:
July 06, 2017
Filing Date:
December 21, 2016
Export Citation:
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Assignee:
SOKEN CHEMICAL & ENGINEERING CO., LTD. (29-5, Takada 3-chome Toshima-k, Tokyo 31, 〒1718531, JP)
International Classes:
C09J4/02; C09J11/06
Domestic Patent References:
WO2015004175A12015-01-15
WO2013084753A12013-06-13
WO2012073684A12012-06-07
Foreign References:
JP2009051944A2009-03-12
JPH1149983A1999-02-23
JPS54158444A1979-12-14
JPS5311932A1978-02-02
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (Gotanda Yamazaki Bldg. 6F, 13-6 Nishigotanda 7-chome, Shinagawa-k, Tokyo 31, 〒1410031, JP)
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