Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/016535
Kind Code:
A1
Abstract:
Provided is an adhesive composition having high adhesiveness to polyamides. The adhesive composition is for bonding adherends comprising a polyamide, and comprises the following components (1) to (4): (meth)acrylates (1) (not including any compound which is the component (2)) comprising (1-1) a (meth)acrylate (which is not the ingredient (1-3)) having an aromatic group, (1-2) a (meth)acrylate having a hydroxy group, and (1-3) a (meth)acrylate represented by general formula (A); an acidic phosphoric acid compound (2); a polymerization initiator (3); and a reducing agent (4) comprising a transition metal salt.
(In formula (A), Z and Z' may be the same or different and each represent a (meth)acryloyl group; R1 and R1' may be the same or different and each represent an alkylene group; R2 and R2' may be the same or different and each represent a hydrogen atom or a C1-4 alkyl group; and p and p' may be the same or different and are each an integer of 0-8.)
Inventors:
SASAKI MAKIKO (JP)
HOSHINO TAKAKO (JP)
NAKAJIMA GOSUKE (JP)
HOSHINO TAKAKO (JP)
NAKAJIMA GOSUKE (JP)
Application Number:
PCT/JP2017/026134
Publication Date:
January 25, 2018
Filing Date:
July 19, 2017
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C09J4/02; B32B27/30; B32B27/34; C09J11/06; C09J201/00
Foreign References:
| JP2001055423A | 2001-02-27 | |||
| JP2005126591A | 2005-05-19 | |||
| JP2001342216A | 2001-12-11 | |||
| JP2002088107A | 2002-03-27 | |||
| JP2002088108A | 2002-03-27 | |||
| JPH05331447A | 1993-12-14 | |||
| JP2005126591A | 2005-05-19 | |||
| JPH11256120A | 1999-09-21 | |||
| JP2012007066A | 2012-01-12 | |||
| JPS59221372A | 1984-12-12 | |||
| JPS59221371A | 1984-12-12 |
Other References:
See also references of EP 3489315A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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