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Patent Searching and Data


Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/043505
Kind Code:
A1
Abstract:
One aspect of the present invention pertains to an adhesive composition for attaching electronic members together, said adhesive composition containing first conductive particles having protrusions capable of penetrating through an oxide coating formed on the surface of an electrode which is an electronic member, and second conductive particles which are conductive particles other than the first conductive particles and each have a non-conductive core body and a conductive layer provided on the core body.

Inventors:
SHIRAKAWA TETSUYUKI (JP)
MATSUMOTO SATORU (JP)
ASAKAWA YUSUKE (JP)
KUMADA TATSUYA (JP)
FUKUI TAKAHIRO (JP)
Application Number:
PCT/JP2017/031010
Publication Date:
March 08, 2018
Filing Date:
August 29, 2017
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J9/02; C09J11/04; C09J201/00
Domestic Patent References:
WO2013150907A12013-10-10
WO2013035164A12013-03-14
Foreign References:
JP2003045229A2003-02-14
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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