Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/056776
Kind Code:
A3
Abstract:
The present application relates to an adhesive composition and an organic electronic device including the same, and provides an adhesive composition and an organic electronic device including the same, the adhesive composition being capable of forming a sealing structure that can effectively block outside moisture or oxygen from entering into an organic electronic device, thereby securing the lifetime of the organic electronic device, and being capable of easily being applied in the process of forming the sealing structure of the organic electronic device, thereby preventing problems related to the clogging of the application nozzle or the inflow of air bubbles into the sealing structure such that the processability can be improved.
Inventors:
KIM SO YOUNG (KR)
LEE SEUNG MIN (KR)
YANG SE WOO (KR)
LEE HYUN SUP (KR)
KIM YEON SOO (KR)
LEE SEUNG MIN (KR)
YANG SE WOO (KR)
LEE HYUN SUP (KR)
KIM YEON SOO (KR)
Application Number:
PCT/KR2017/010548
Publication Date:
August 09, 2018
Filing Date:
September 25, 2017
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C09J123/00; C09J11/04; H01L23/29; H01L33/56
Foreign References:
| KR20120091349A | 2012-08-17 | |||
| US20150056757A1 | 2015-02-26 | |||
| KR20160096047A | 2016-08-12 | |||
| KR20150010667A | 2015-01-28 | |||
| US20110105637A1 | 2011-05-05 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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