Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/069610
Kind Code:
A1
Abstract:
One aspect of the present invention pertains to an adhesive composition which contains a thermoplastic polymer as a base polymer, wherein: the composition does not contain an α-methyl styrene-based resin; the storage modulus G' at a temperature of 40ºC and a frequency of 0.1 Hz is not less than 20,000 Pa, and/or the loss elastic modulus G'' at a temperature of 40ºC and a frequency of 0.1 Hz is not less than 4,300 Pa; and the storage modulus G' at a temperature of 40ºC and a frequency of 1 Hz is not more than 32,000 Pa, and/or the loss elastic modulus G'' at a temperature of 40ºC and a frequency of 1 Hz is not more than 11,000 Pa.
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Inventors:
SAMITSU MAKI (JP)
MIYAMARU SATORU (JP)
MATSUMOTO TAKASHI (JP)
MIYAMARU SATORU (JP)
MATSUMOTO TAKASHI (JP)
Application Number:
PCT/JP2018/032673
Publication Date:
April 11, 2019
Filing Date:
September 03, 2018
Export Citation:
Assignee:
MORESCO CORP (JP)
International Classes:
C09J201/00
Foreign References:
| JP2008297441A | 2008-12-11 | |||
| JP2005054072A | 2005-03-03 | |||
| JP2007039451A | 2007-02-15 | |||
| JP2001011414A | 2001-01-16 | |||
| JP2016153448A | 2016-08-25 | |||
| JP2016065121A | 2016-04-28 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
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