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Patent Searching and Data


Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/054495
Kind Code:
A1
Abstract:
The adhesive composition according to the present invention, which is capable of realizing low-temperature quick-curing properties, conductive properties, shelf life properties, and adhesive strength that are practical not only for COG mounting, but also for FOG mounting and FOP mounting, contains a cation-polymerizable component, a cation polymerization initiator, an elastomer, and a film-forming component. The cation-polymerizable component is an alicyclic epoxy compound or a low-polarity oxetane compound, and the cation polymerization initiator is a quaternary ammonium salt thermal acid generator. With respect to the total mass of the cation-polymerizable component, elastomer, and film-forming component, the cation-polymerizable component content is 10–40 mass%, the elastomer content is 10–40 mass%, and the film-forming component content is 40–80 mass%.

Inventors:
HATTORI MASAAKI (JP)
Application Number:
PCT/JP2019/034517
Publication Date:
March 19, 2020
Filing Date:
September 03, 2019
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Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J9/02; C09J163/00; C09J11/06; C09J11/08; C09J119/00; C09J171/10; H01B1/22; H01B5/16
Foreign References:
JP2017152354A2017-08-31
JP2010272546A2010-12-02
JP2009054377A2009-03-12
JP2016060761A2016-04-25
JP2009280790A2009-12-03
JP2010251336A2010-11-04
JP2014031464A2014-02-20
JP2013164984A2013-08-22
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
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