Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/045157
Kind Code:
A1
Abstract:
Provided is an adhesive composition that makes it possible to prevent resin flow on the occasion of thermocompression bonding by controlling mechanical characteristics, that exhibits suitable electrical characteristics, and whereby it is possible to form an adhesive layer having suitable adhesion. The adhesive composition contains at least an inorganic filler and a resin composition including a styrene elastomer. The content of the inorganic filler is 1-180 parts by mass with respect to 100 parts by mass of the resin composition. The inorganic filler has a plate-like or scale-like shape. An adhesive layer obtained by curing the adhesive composition has a dielectric constant of 3.5 or less at a frequency of 28 GHz. The dielectric loss tangent of the adhesive layer at a frequency of 28 GHz is 0.005 or less.
Inventors:
MOMMA SHIORI (JP)
KATAGIRI WATARU (JP)
KATAGIRI WATARU (JP)
Application Number:
PCT/JP2021/031051
Publication Date:
March 03, 2022
Filing Date:
August 24, 2021
Export Citation:
Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
B32B27/00; C09J11/04; C09J109/06; C09J125/08; C09J163/00; H05K1/03
Domestic Patent References:
| WO2020071154A1 | 2020-04-09 | |||
| WO2017154995A1 | 2017-09-14 |
Foreign References:
| JP2019199612A | 2019-11-21 | |||
| JP2015040296A | 2015-03-02 | |||
| JP2017132858A | 2017-08-03 | |||
| JPH11340593A | 1999-12-10 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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