Title:
ADHESIVE CONFIGURATION, ELECTRONIC EQUIPMENT, AND ADHESION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/106239
Kind Code:
A1
Abstract:
This adhesive configuration includes multiple adhesive regions (AR) in which an adhesive agent (3) has different thicknesses depending on multiple required adhesion performances for an adhesive section.
More Like This:
| JP3195605 | [Title of Invention] Adhesion Method |
Inventors:
HONDA NORIYUKI (JP)
NISHIMURA YOSHIHIRO (JP)
NISHIMURA YOSHIHIRO (JP)
Application Number:
PCT/JP2022/044590
Publication Date:
June 15, 2023
Filing Date:
December 02, 2022
Export Citation:
Assignee:
SONY GROUP CORP (JP)
International Classes:
C09J5/00; C09J201/00
Foreign References:
| JP2017130318A | 2017-07-27 | |||
| JP2018508915A | 2018-03-29 | |||
| JP2017170828A | 2017-09-28 | |||
| JP2001031929A | 2001-02-06 | |||
| JP2019111173A | 2019-07-11 | |||
| JP2004187411A | 2004-07-02 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF: