ADHESIVE CONTAINING POLYDIMETHYLSILOXANE

WIPO Patent Application WO/2017/221772

A1

[Problem] To provide an adhesive which can be easily removed off after wafer back surface polishing and which has heat resistance and can be easily washed off. [Solution] An adhesive which is for separably bonding a support to the circuit-bearing surface of a wafer and thereby enabling the back surface of the wafer to be processed and which cures upon heating from the support side or the wafer side to thereby make it possible to select a plane where the adhesive layer is peeled off, the adhesive comprising a component (A), which cures through hydrosilylation, and a component (B), which comprises a polydimethylsiloxane and which may be a polydimethylsiloxane having a viscosity of 1,100-2,000,000 mm2/s; a method for laminate formation, the method comprising bonding a surface of a second substrate to an adhesive layer obtained by applying the adhesive to a surface of a first substrate and heating the assemblage from the first substrate side; and a separation method comprising bonding a surface of a second substrate to an adhesive layer obtained by applying the adhesive to a surface of a first substrate, heating the assemblage from the first substrate side to cure the adhesive and form a laminate, subsequently processing the laminate, and causing a separation between the first substrate and the adhesive layer.

OGINO HIROSHI (JP)
ENOMOTO TOMOYUKI (JP)
SHINJO TETSUYA (JP)
SAWADA KAZUHIRO (JP)
MORIYA SHUNSUKE (JP)

PCT/JP2017/021834

December 28, 2017

June 13, 2017

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NISSAN CHEMICAL IND LTD (JP)

H01L21/304; C09J5/06; C09J11/06; C09J183/04; C09J183/05

WO2015190438A1

2015-12-17

JP2014146793A	2014-08-14
JP2016086158A	2016-05-19
JP2008088271A	2008-04-17

See also references of EP 3477685A4

HANABUSA PATENT & TRADEMARK OFFICE (JP)

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