Title:
ADHESIVE CONTAINING POLYETHER-MODIFIED SILOXANE
Document Type and Number:
WIPO Patent Application WO/2023/182138
Kind Code:
A1
Abstract:
The present invention provides an adhesive and a laminated body having the adhesive. The adhesive exhibits excellent performance in spin coating onto a wafer circuit surface or a support body (support substrate), is excellent in heat resistance in joining a wafer circuit surface and a support body via the adhesive layer and in processing a wafer back surface, and facilitates peeling of the wafer from the support body after processing the wafer (after polishing the wafer back surface, for example). The adhesive adheres a support body and a wafer circuit surface in a peelable manner and is for processing the back surface of the wafer. The adhesive includes: a component (A) curing through hydrosilylation reaction; and a component (B) including a polyether-modified siloxane.
Inventors:
YANAI MASAKI (JP)
OKUNO TAKAHISA (JP)
SHINJO TETSUYA (JP)
OKUNO TAKAHISA (JP)
SHINJO TETSUYA (JP)
Application Number:
PCT/JP2023/010292
Publication Date:
September 28, 2023
Filing Date:
March 16, 2023
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
H01L21/304; C08L83/05; C08L83/07; C08L83/12; C09J183/05; C09J183/07; H01L21/02
Domestic Patent References:
| WO2018159236A1 | 2018-09-07 | |||
| WO2019003563A1 | 2019-01-03 | |||
| WO2015072418A1 | 2015-05-21 | |||
| WO2018216732A1 | 2018-11-29 | |||
| WO2015190478A1 | 2015-12-17 |
Foreign References:
| JP2013082801A | 2013-05-09 | |||
| JP2012229333A | 2012-11-22 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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