Title:
ADHESIVE FOR CORRUGATED BOARD
Document Type and Number:
WIPO Patent Application WO/2014/065265
Kind Code:
A1
Abstract:
An adhesive for corrugated board containing starch glue and an alkali contains a buffering-action-exhibiting agent (excluding boron compounds) and a water-resistant additive. The buffering-action-exhibiting agent is selected from an inorganic acid, an organic acid (alkali salt), etc. that exhibit a pH buffering effect on being added. The water-resistant additive is a chemical that provides water resistance to the starch powder upon polymerizing. This adhesive for corrugated board has adhesive performance at least as good as a conventional boron-compound-containing starch-based adhesive, even if a boron compound is not used.
Inventors:
KAWAMATSU TETSUYA (JP)
Application Number:
PCT/JP2013/078544
Publication Date:
May 01, 2014
Filing Date:
October 22, 2013
Export Citation:
Assignee:
JAPAN CORN STARCH CO LTD (JP)
International Classes:
C09J103/00; C09J11/00; C09J103/04
Foreign References:
| JP2005226011A | 2005-08-25 | |||
| JPS59145266A | 1984-08-20 | |||
| JPH05179215A | 1993-07-20 | |||
| JPH01278588A | 1989-11-08 | |||
| JPS5516095A | 1980-02-04 | |||
| JP2005097430A | 2005-04-14 |
Attorney, Agent or Firm:
IIDA, Akio et al. (JP)
Akio Iida (JP)
Akio Iida (JP)
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