Title:
ADHESIVE DAMPING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2015/019800
Kind Code:
A1
Abstract:
This adhesive damping material is provided with a damping layer and a constraining layer that is laminated on the damping layer. The damping layer has a tanδ peak of 1.0 or more within the range from -20°C to 20°C as measured in a shear mode at a heating rate of 5°C/min at a frequency of 1 Hz. The damping layer has a thermal conductivity of 0.40 W/m·K or more.
More Like This:
Inventors:
KAWAGUCHI YASUHIKO (JP)
Application Number:
PCT/JP2014/068682
Publication Date:
February 12, 2015
Filing Date:
July 14, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B7/02; B32B15/06; F16F15/02
Foreign References:
JPH05310993A | 1993-11-22 | |||
JPH10208462A | 1998-08-07 | |||
JPH07278354A | 1995-10-24 | |||
JPH0399247U | 1991-10-16 | |||
JP2000336279A | 2000-12-05 | |||
JP2007111876A | 2007-05-10 | |||
JPH06143485A | 1994-05-24 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
Download PDF: