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Title:
ADHESIVE DAMPING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2015/019800
Kind Code:
A1
Abstract:
This adhesive damping material is provided with a damping layer and a constraining layer that is laminated on the damping layer. The damping layer has a tanδ peak of 1.0 or more within the range from -20°C to 20°C as measured in a shear mode at a heating rate of 5°C/min at a frequency of 1 Hz. The damping layer has a thermal conductivity of 0.40 W/m·K or more.

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Inventors:
KAWAGUCHI YASUHIKO (JP)
Application Number:
PCT/JP2014/068682
Publication Date:
February 12, 2015
Filing Date:
July 14, 2014
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B7/02; B32B15/06; F16F15/02
Foreign References:
JPH05310993A1993-11-22
JPH10208462A1998-08-07
JPH07278354A1995-10-24
JPH0399247U1991-10-16
JP2000336279A2000-12-05
JP2007111876A2007-05-10
JPH06143485A1994-05-24
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
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