Title:
ADHESIVE FOR ELECTRONIC COMPONENTS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR CHIP MOUNT
Document Type and Number:
WIPO Patent Application WO/2012/121336
Kind Code:
A1
Abstract:
One purpose of the present invention is to provide an adhesive for electronic components that suppresses the formation of voids and is not susceptible to piling up on a semiconductor chip surface. Furthermore, another purpose of the present invention is to provide a manufacturing method for a semiconductor chip mount using the adhesive for electronic components. An adhesive for electronic components that contains a curable compound, a curing agent, and an inorganic filler, wherein if A1 represents the viscosity (Pa・s) at 5rpm, as measured by using an E-type viscometer at 25°C, and A2 represents the viscosity (Pa・s) at 0.5rpm, then A1 and A2/A1 are within the range indicated by the solid and broken lines in figure 1 (the solid line itself is included but the broken line itself is not included). The content of the curing agent is 5-150 parts by weight and the content of the inorganic filler is 60-400 parts by weight per the curable compound being 100 parts by weight of the current composition.
Inventors:
DILAO CARL ALVIN (JP)
HAYAKAWA AKINOBU (JP)
SADANAGA SHUJIRO (JP)
HATAI MUNEHIRO (JP)
HAYAKAWA AKINOBU (JP)
SADANAGA SHUJIRO (JP)
HATAI MUNEHIRO (JP)
Application Number:
PCT/JP2012/055985
Publication Date:
September 13, 2012
Filing Date:
March 08, 2012
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
DILAO CARL ALVIN (JP)
HAYAKAWA AKINOBU (JP)
SADANAGA SHUJIRO (JP)
HATAI MUNEHIRO (JP)
DILAO CARL ALVIN (JP)
HAYAKAWA AKINOBU (JP)
SADANAGA SHUJIRO (JP)
HATAI MUNEHIRO (JP)
International Classes:
H01L21/60; C09J11/04; C09J163/00; C09J185/00; C09J201/00; C09J201/02; H01L23/29; H01L23/31
Foreign References:
| JP2006286916A | 2006-10-19 | |||
| JP2004363434A | 2004-12-24 | |||
| JP2007258508A | 2007-10-04 | |||
| JP2005032796A | 2005-02-03 | |||
| JP2003258034A | 2003-09-12 | |||
| JP2010010669A | 2010-01-14 |
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
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