Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION, MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE FILM ACCOMMODATING SET
Document Type and Number:
WIPO Patent Application WO/2020/184583
Kind Code:
A1
Abstract:
An adhesive film 1 for circuit connection comprises a first adhesive layer 2 and a second adhesive layer 3 laminated on the first adhesive layer 2, wherein the first adhesive layer 2 is composed of a photocured product of a photocurable thermosetting composition including a polymerizable compound, a photopolymerization initiator, a thermal polymerization initiator, and conductive particles 4, and the second adhesive layer 3 is composed of a thermosetting composition.
Inventors:
OTO YUMIKO (JP)
KUDO SUNAO (JP)
ITO AKIHIRO (JP)
KUDO SUNAO (JP)
ITO AKIHIRO (JP)
Application Number:
PCT/JP2020/010385
Publication Date:
September 17, 2020
Filing Date:
March 10, 2020
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B32B27/00; B32B27/18; C09J4/00; C09J7/35; C09J9/02; C09J201/00; H01B1/22; H01B5/16; H01B13/00; H01L21/60; H01R11/01; H01R43/00; H05K1/14; H05K3/36
Domestic Patent References:
| WO2018181589A1 | 2018-10-04 | |||
| WO2012091061A1 | 2012-07-05 | |||
| WO2013024873A1 | 2013-02-21 |
Foreign References:
| JP2014043574A | 2014-03-13 | |||
| JP2009016133A | 2009-01-22 | |||
| JP2017135065A | 2017-08-03 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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