Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR MANUFACTURING SAME, METHOD FOR MANUFACTURING CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE TAPE-CONTAINING SET
Document Type and Number:
WIPO Patent Application WO/2019/050006
Kind Code:
A1
Abstract:
An adhesive film 1 for circuit connection, said adhesive film 1 being provided with a first adhesive layer 2 and a second adhesive layer 3 that is laminated on the first adhesive layer 2, wherein: the first adhesive layer 2 is formed of a cured product of a photo-curable composition; the second adhesive layer 3 is formed of a heat-curable composition; and the photo-curable composition comprises a polymerizable compound, conductive particles 4 and a photopolymerization initiator having at least one structure selected from the group consisting of a structure represented by formula (I), a structure represented by formula (II) and a structure represented by formula (III).
Inventors:
OTO YUMIKO (JP)
IZAWA HIROYUKI (JP)
KUDOU SUNAO (JP)
MORIJIRI TOMOKI (JP)
IZAWA HIROYUKI (JP)
KUDOU SUNAO (JP)
MORIJIRI TOMOKI (JP)
Application Number:
PCT/JP2018/033262
Publication Date:
March 14, 2019
Filing Date:
September 07, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H05K1/14; C09J7/10; C09J7/30; C09J11/00; C09J11/06; C09J201/00; H01B1/20; H01B13/00; H01R11/01; H01R43/00
Domestic Patent References:
| WO2007125993A1 | 2007-11-08 |
Foreign References:
| JP2009016133A | 2009-01-22 | |||
| JP2016082070A | 2016-05-16 | |||
| JP2016033021A | 2016-03-10 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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