Title:
ADHESIVE FILM FOR CONNECTING CIRCUIT, CIRCUIT CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/276889
Kind Code:
A1
Abstract:
This adhesive film for connecting a circuit comprises: a resin component containing a thermoplastic resin, a radically polymerizable compound, and a radical polymerization initiator; and conductive particles, wherein the resin component further contains a silane coupling agent having a fluorene skeleton.
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Inventors:
IWAMOTO SHINNOSUKE (JP)
KUDO SUNAO (JP)
KUDO SUNAO (JP)
Application Number:
PCT/JP2022/025349
Publication Date:
January 05, 2023
Filing Date:
June 24, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H05K1/14; C09J4/00; C09J7/30; C09J9/02; C09J11/06; C09J11/08; H01B1/22; H05K3/32
Domestic Patent References:
| WO2020202656A1 | 2020-10-08 |
Foreign References:
| JP2011256391A | 2011-12-22 | |||
| JP2018028044A | 2018-02-22 | |||
| JP2017155009A | 2017-09-07 | |||
| JP2012233142A | 2012-11-29 | |||
| JP2020180063A | 2020-11-05 | |||
| JP2020166215A | 2020-10-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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