ADHESIVE FILM AND ELECTRONIC DEVICE MANUFACTURING METHOD

Title:

ADHESIVE FILM AND ELECTRONIC DEVICE MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2019/188546

Kind Code:

A1

Abstract:

This adhesive film (50) is provided with a substrate layer (10), an adhesive resin layer (A) which is provided on a first side (10A) of the substrate layer (10), and an adhesive resin layer (B) which is provided on the second side (10B) of the substrate layer (10) and which has an adhesive force that decreases with external stimulation. The adhesive resin layer (B) side is attached to a stainless steel plate and then a microscope slide is placed on and adhered to the adhesive resin layer (A); thereafter, heat treatment is performed at 130°C for 30 minutes, and then, in a vacuum oven, when the pressure in the vacuum oven has been reduced at 125°C at an evacuation speed of 120L/min, no lifting of the adhesive film (50) from the stainless steel plate is observed before the pressure inside of the vacuum oven has reached 100 Pa.

Inventors:

IGARASHI KOUJI (DE)
KINOSHITA JIN (JP)
KURIHARA HIROYOSHI (JP)
MIURA TORU (JP)

Application Number:

PCT/JP2019/011341

Publication Date:

October 03, 2019

Filing Date:

March 19, 2019

Export Citation:

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Assignee:

MITSUI CHEMICALS TOHCELLO INC (JP)

International Classes:

C09J7/38; C09J11/00; C09J133/00; C09J201/00; H01L21/56

Domestic Patent References:

WO2013011850A1

2013-01-24

Foreign References:

JP2012062373A	2012-03-29
JPH05279640A	1993-10-26
JP2005503469A	2005-02-03
JP2013104052A	2013-05-30
JPH06306337A	1994-11-01
JP2011134811A	2011-07-07
JP2018061343A	2018-04-12

Other References: