Title:
ADHESIVE FILM, HEAT MOLDED BODY AND METHOD FOR PRODUCING ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2024/048432
Kind Code:
A1
Abstract:
The present invention provides: an adhesive film which exhibits excellent moldability; a heat molded body; and a method for producing an adhesive film. This adhesive film comprises a base material film that contains a polycarbonate, a primer layer that is arranged on at least one surface of the base material film, and an adhesive layer that is arranged on a surface on the reverse side of the primer layer from the base material film; and the primer layer is formed of a primer layer composition that contains an oligomer diol.
Inventors:
KAKEYA FUMIAKI (JP)
Application Number:
PCT/JP2023/030649
Publication Date:
March 07, 2024
Filing Date:
August 25, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C09J7/50; C09D5/00; C09J7/25; C09J7/38; C09J133/04
Domestic Patent References:
| WO2020162395A1 | 2020-08-13 | |||
| WO2013151169A1 | 2013-10-10 |
Foreign References:
| JP2006001951A | 2006-01-05 | |||
| JP2005126504A | 2005-05-19 | |||
| JP2005272558A | 2005-10-06 | |||
| JP2005225127A | 2005-08-25 | |||
| JP2014511421A | 2014-05-15 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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