ADHESIVE FILM AND METHOD FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING THE SAME

Title:

ADHESIVE FILM AND METHOD FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING THE SAME

Document Type and Number:

WIPO Patent Application WO/2012/060621

Kind Code:

A3

Abstract:

The present invention relates to an adhesive film, an encapsulating product of an organic electronic device using the same, and a method for encapsulating the organic electronic device, and more particularly, to an adhesive film for encapsulating an organic electronic device and a method for encapsulating the organic electronic device using the adhesive film. Here, the adhesive film includes a curable hot melt-type adhesive layer containing a curable resin and water absorbent. The curable hot melt-type adhesive layer has a first area contacting the organic electronic device when the organic electronic device is encapsulated and a second area which does not contact the organic electronic device. The curable hot melt-type adhesive layer contains the water absorbent ranging from about 0% to about 20% in the first area and ranging from about 80% to about 100% in the second area, based on the total mass of the water absorbent within the adhesive layer.

Inventors:

YOO HYUN JEE (KR)
CHO YOON GYUNG (KR)
SHIM JUNG SUP (KR)
LEE SUK CHIN (KR)
JEONG KWANG JIN (KR)

Application Number:

PCT/KR2011/008280

Publication Date:

July 05, 2012

Filing Date:

November 02, 2011

Export Citation:

Click for automatic bibliography generation Help

Assignee:

LG CHEMICAL LTD (KR)
YOO HYUN JEE (KR)
CHO YOON GYUNG (KR)
CHANG SUK KY (KR)
SHIM JUNG SUP (KR)
LEE SUK CHIN (KR)
JEONG KWANG JIN (KR)

International Classes:

H01L51/52; C09J7/10; H05B33/04

Foreign References:

JP2002260847A	2002-09-13
JP2004335208A	2004-11-25
JP2004139977A	2004-05-13
JP2005339863A	2005-12-08

Other References: