Title:
ADHESIVE FILM AND METHOD FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/021687
Kind Code:
A1
Abstract:
The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for encapsulating an organic electronic device comprises: a protective film layer, a first adhesive layer, a second adhesive layer and a release film layer sequentially arranged. The peel strength (A) between the first adhesive layer and the protective film layer is lower than the peel strength (B) between the second adhesive layer and the release film layer, and the peel strength (B) between the second adhesive layer and the release film layer is lower than the peel strength (C) between the first adhesive layer and an encapsulation substrate, thus improving faults during a peeling process.
Inventors:
BAE KYUNG YUL (KR)
YOO HYUN JEE (KR)
LEE SEUNG MIN (KR)
CHO YOON GYUNG (KR)
CHANG SUK KY (KR)
SHIM JUNG SUP (KR)
YOO HYUN JEE (KR)
LEE SEUNG MIN (KR)
CHO YOON GYUNG (KR)
CHANG SUK KY (KR)
SHIM JUNG SUP (KR)
Application Number:
PCT/KR2013/007013
Publication Date:
February 06, 2014
Filing Date:
August 02, 2013
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C09J7/10; C09J201/00; H01L51/50
Domestic Patent References:
| WO2012060621A2 | 2012-05-10 |
Foreign References:
| JP2003177241A | 2003-06-27 | |||
| KR20080088606A | 2008-10-02 | |||
| JP4699676B2 | 2011-06-15 | |||
| KR20100116712A | 2010-11-01 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
특허법인 다나 (KR)
특허법인 다나 (KR)
Download PDF: