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Patent Searching and Data


Title:
ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/119547
Kind Code:
A1
Abstract:
Provided is an adhesive film which has excellent adhesion even to a nonpolar surface and a method for manufacturing electronic components using the same. An adhesive film which has a first layer (11) that comprises a thermosetting resin and a curing agent and a second layer (12) that comprises 50 wt% or more of a styrene-based hydrogenated block copolymer is disposed such that a nonpolar surface is on the side of the second layer. As the second layer (12) comprises a styrene-based hydrogenated block copolymer, this adhesive film is capable of obtaining sufficient adhesion even to an adherent with components of a nonpolar film adhered to a surface thereof.

Inventors:
ODAKA RYOSUKE (JP)
SATO DAISUKE (JP)
Application Number:
PCT/JP2014/051783
Publication Date:
August 07, 2014
Filing Date:
January 28, 2014
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J7/10; C09J9/02; C09J11/08; C09J153/02; C09J201/00
Domestic Patent References:
WO1998038261A11998-09-03
WO2001068785A12001-09-20
Foreign References:
JP2005255829A2005-09-22
JP2012094834A2012-05-17
JPH09312176A1997-12-02
Attorney, Agent or Firm:
KOIKE, Akira et al. (JP)
Akira Koike (JP)
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