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Patent Searching and Data


Title:
ADHESIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/135546
Kind Code:
A1
Abstract:
An adhesive film (50) according to the present invention can be used for temporally fixing an electronic component in the sealing of the electronic component with a sealing material in the process of manufacturing an electronic device, and is provided with a base layer (10), an adhesive resin layer (A) which is arranged on the first surface (10A) side of the base layer (10) and can temporally fix the electronic component, and an adhesive resin layer (B) which is arranged on the second surface (10B) side of the base layer (10) and can be decreased in an adhesion power upon the application of an external stimulation, wherein the adhesive resin layer (A) contains a polyhydric carboxylic acid ester-type plasticizer (X) and an adhesive resin (Y) and the content of the polyhydric carboxylic acid ester-type plasticizer (X) in the adhesive resin layer (A) is 0.7 to 50 parts by mass inclusive relative to 100 parts by mass of the adhesive resin (Y) contained in the adhesive resin layer (A).

Inventors:
IGARASHI KOUJI (JP)
KINOSHITA JIN (JP)
KURIHARA HIROYOSHI (JP)
Application Number:
PCT/JP2018/001271
Publication Date:
July 26, 2018
Filing Date:
January 17, 2018
Export Citation:
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Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
C09J7/20; B32B27/00; C09J11/06; C09J133/00; C09J201/00; H01L21/56
Domestic Patent References:
WO2015029871A12015-03-05
Foreign References:
JP2011129649A2011-06-30
JP2011134811A2011-07-07
JP2011134811A2011-07-07
JP2017008618A2017-01-12
Other References:
See also references of EP 3572478A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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