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Patent Searching and Data


Title:
ADHESIVE FILM, MULTILAYER PRINTED WIRING BOARD USING ADHESIVE FILM, AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2013/005847
Kind Code:
A1
Abstract:
This adhesive film comprises a resin composition layer (layer (A)) for an interlayer insulating layer, a thermosetting resin composition layer (layer (B)) and a supporting film (layer (C)), and the layer (C), the layer (A) and the layer (B) are sequentially arranged in this order. The layer (A) is formed of a resin composition that contains a thermosetting resin (a1) and an inorganic filler (b1) having a specific surface area of 20 m2/g or more, with the mass ratio of the thermosetting resin (a1) to the inorganic filler (b1) being within the range from 30:1 to 2:1. The layer (B) contains a thermosetting resin composition that is in a solid state at a temperature less than 40˚C but is melted at a temperature of 40˚C or more but less than 140˚C. Consequently, this adhesive film is able to resolve problems in a laser process and a desmear process following the laser process and is capable of providing a conductive layer that has high adhesion strength even to an interlayer insulating layer having a smooth roughened surface state.

Inventors:
MATSUURA MASAHARU (JP)
OGAWA NOBUYUKI (JP)
FUJITA HIROAKI (JP)
FUKAI HIROYUKI (JP)
Application Number:
PCT/JP2012/067395
Publication Date:
January 10, 2013
Filing Date:
July 06, 2012
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
MATSUURA MASAHARU (JP)
OGAWA NOBUYUKI (JP)
FUJITA HIROAKI (JP)
FUKAI HIROYUKI (JP)
International Classes:
H05K3/46; C09J7/20; H05K3/38
Domestic Patent References:
WO2010050472A12010-05-06
WO2003047324A12003-06-05
Foreign References:
JP2011086729A2011-04-28
JP2010135477A2010-06-17
JP2009119855A2009-06-04
JP2003277579A2003-10-02
JP2010001403A2010-01-07
JP2006037083A2006-02-09
JP2010260971A2010-11-18
JPH0199288A1989-04-18
JP2008130796A2008-06-05
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
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Claims: