Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE FILM FOR ORGANIC ELECTRONIC DEVICE AND ENCAPSULATION MATERIAL FOR ORGANIC ELECTRONIC DEVICE INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2019/009485
Kind Code:
A1
Abstract:
The present invention relates to an adhesive film for an organic electronic device and an encapsulation material which is for an organic electronic device and includes the same, and more particularly, to an adhesive film for an organic electronic device and an encapsulation material which is for an organic electronic device and includes the same, wherein the adhesive film can remove and block defect-causing materials, such as moisture or impurities etc., to prevent such defect-causing materials from accessing the organic electronic device, has excellent moisture resistance and thermal resistance, and does not suffer from interlayer peeling that can occur during moisture removal.

Inventors:
LEE SANG PIL (KR)
PARK SOON CHUN (KR)
KONG LEE SEONG (KR)
KIM JOON HO (KR)
ROH JUNG SUB (KR)
CHOI CHANG HWON (KR)
Application Number:
PCT/KR2018/000535
Publication Date:
January 10, 2019
Filing Date:
January 11, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
INNOX ADVANCED MAT CO LTD (KR)
International Classes:
C09J123/16; C09J7/00; C09J11/04; C09J11/08; C09J123/20; H01L51/52
Foreign References:
KR20160095851A2016-08-12
KR20150135192A2015-12-02
KR20150016880A2015-02-13
KR20150126467A2015-11-12
KR101693797B12017-01-09
KR101687334B12016-12-19
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: METHOD FOR PRODUCING COAL BRIQUETTE, AND COAL BRIQUETTE PRODUCED BY SAME

Next Patent: SYSTEM AND METHOD FOR OPTICAL TRACKING