Title:
ADHESIVE FILM, PRODUCTION PROCESS THEREFOR, ADHESIVE TAPE, AND REEL FOR ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2017/130789
Kind Code:
A1
Abstract:
In one embodiment, the present invention provides an adhesive film 1 which comprises, superposed in the following order, a first non-electroconductive adhesive layer 2, an electroconductive adhesive layer 3 containing electroconductive particles 5, and a second non-electroconductive adhesive layer 4, wherein the thickness T1 of the first non-electroconductive adhesive layer 2 and the thickness T of the electroconductive adhesive layer 3 satisfy the following relationship (1).
T1
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Inventors:
TATSUZAWA TAKASHI (JP)
TANAKA MASARU (JP)
TANAKA MASARU (JP)
Application Number:
PCT/JP2017/001366
Publication Date:
August 03, 2017
Filing Date:
January 17, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B32B27/00; B32B27/18; B65H75/14; C09J7/10; C09J9/02; C09J11/04; C09J201/00
Domestic Patent References:
| WO2007123003A1 | 2007-11-01 |
Foreign References:
| JP2009194359A | 2009-08-27 | |||
| JP2005200521A | 2005-07-28 | |||
| JP2010183049A | 2010-08-19 | |||
| JP2015187221A | 2015-10-29 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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