Title:
ADHESIVE FILM FOR A SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2012/173325
Kind Code:
A1
Abstract:
The present invention relates to an adhesive film for a semiconductor package. In the adhesive film, an adhesive layer (2) for dicing a wafer and an adhesive layer (3) for die bonding are successively stacked on a base film (1). The adhesive layer for dicing consists of an ultraviolet curing-type resin composition. The adhesive layer for die bonding consists of a mixture of a thermosetting resin and a thermoplastic resin, each of which does not contain inorganic particles. When a plurality of semiconductor chips are vertically mounted on a circuit board using the adhesive film which does not contain inorganic particles, pattern damage and chip cracking caused by large-scale particles between the vertical semiconductor chips may be prevented from occurring.
Inventors:
KIM KWANG-MOO (KR)
KWEON JEONG-MIN (KR)
PARK DUCK-HA (KR)
LEE KYUNG-HWAN (KR)
HA JU-HEE (KR)
LEE DONG-YUL (KR)
PARK IN-BAE (KR)
LEE JONG-HOON (KR)
KWEON JEONG-MIN (KR)
PARK DUCK-HA (KR)
LEE KYUNG-HWAN (KR)
HA JU-HEE (KR)
LEE DONG-YUL (KR)
PARK IN-BAE (KR)
LEE JONG-HOON (KR)
Application Number:
PCT/KR2012/001359
Publication Date:
December 20, 2012
Filing Date:
February 22, 2012
Export Citation:
Assignee:
INNOX CORP (KR)
KIM KWANG-MOO (KR)
KWEON JEONG-MIN (KR)
PARK DUCK-HA (KR)
LEE KYUNG-HWAN (KR)
HA JU-HEE (KR)
LEE DONG-YUL (KR)
PARK IN-BAE (KR)
LEE JONG-HOON (KR)
KIM KWANG-MOO (KR)
KWEON JEONG-MIN (KR)
PARK DUCK-HA (KR)
LEE KYUNG-HWAN (KR)
HA JU-HEE (KR)
LEE DONG-YUL (KR)
PARK IN-BAE (KR)
LEE JONG-HOON (KR)
International Classes:
C09J7/22; C09J7/30; C09J163/00; C09J201/00; H01L21/02
Foreign References:
| KR100894173B1 | 2009-04-22 | |||
| JP2007059787A | 2007-03-08 | |||
| KR20090111260A | 2009-10-26 | |||
| KR20090121254A | 2009-11-25 |
Attorney, Agent or Firm:
DAE-A INTELLECTUAL PROPERTY CONSULTING (KR)
특허법인 대아 (KR)
특허법인 대아 (KR)
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Claims: