Title:
ADHESIVE FILM FOR SEMICONDUCTOR AND ADHESIVE SHEET FOR SEMICONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2019/107198
Kind Code:
A1
Abstract:
The present invention provides: an adhesive film (1) for a semiconductor, the adhesive film (1) containing a thermosetting adhesive and 15-70% by mass of a titanium oxide filler; and an adhesive sheet (2) for a semiconductor, the adhesive sheet (2) being such that the adhesive film (1) for a semiconductor is provided on a release sheet (21).
Inventors:
TANAKA YUYA (JP)
FUSE KEISHI (JP)
FUSE KEISHI (JP)
Application Number:
PCT/JP2018/042659
Publication Date:
June 06, 2019
Filing Date:
November 19, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/52; C09J7/35; C09J11/04; C09J201/00
Domestic Patent References:
| WO2017029917A1 | 2017-02-23 |
Foreign References:
| JP2002294177A | 2002-10-09 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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