Title:
ADHESIVE FILM, SUPPORT-SHEET-EQUIPPED ADHESIVE FILM, AND STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/097443
Kind Code:
A1
Abstract:
An adhesive film containing a thermally conductive filler (A) having a two-dimensional crystal structure, an epoxy component (B), a curing agent (C), and a binder polymer (D), the adhesive film 1 being such that at least one of the epoxy component (B) and the curing agent (C) has a conjugated mesogenic skeleton. This adhesive film 1 exhibits exceptional thermal conductivity.
Inventors:
ICHIKAWA ISAO (JP)
YOSHINOBU TAKEO (JP)
YOSHINOBU TAKEO (JP)
Application Number:
PCT/JP2021/038058
Publication Date:
May 12, 2022
Filing Date:
October 14, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; C09J7/35; C09J11/04; C09J163/00; C09J201/00; H05K7/20
Domestic Patent References:
| WO2002094905A1 | 2002-11-28 | |||
| WO2018079533A1 | 2018-05-03 |
Foreign References:
| KR20130086902A | 2013-08-05 | |||
| JP2016189412A | 2016-11-04 | |||
| JP2015034269A | 2015-02-19 | |||
| JP2014156531A | 2014-08-28 | |||
| JP2020063433A | 2020-04-23 | |||
| CN110982457A | 2020-04-10 | |||
| CN109868085A | 2019-06-11 | |||
| CN111171782A | 2020-05-19 | |||
| CN111363381A | 2020-07-03 | |||
| JP2012039064A | 2012-02-23 | |||
| JP2016014090A | 2016-01-28 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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