Title:
ADHESIVE FILM FOR USE IN SEMICONDUCTOR DEVICE MANUFACTURING, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/170452
Kind Code:
A1
Abstract:
This adhesive film (50), for use in semiconductor device manufacturing, is used for temporarily fixing an electronic component (70) when sealing the electronic component (70) by means of a sealing member (60) in a semiconductor device manufacturing process, and is provided with a base material layer (10), and an adhesive resin layer (A) which is provided on a first surface (10A) of the base material layer (10) and which is for temporarily fixing the electronic component (70). Further, the surface free energy of the surface of the adhesive resin layer (A) is less than or equal to 38.0 mN/m.
Inventors:
IGARASHI KOUJI (JP)
MORIMOTO AKIMITSU (JP)
FUKUMOTO HIDEKI (JP)
MORIMOTO AKIMITSU (JP)
FUKUMOTO HIDEKI (JP)
Application Number:
PCT/JP2017/012479
Publication Date:
October 05, 2017
Filing Date:
March 27, 2017
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
C09J7/20; H01L21/56; C09J133/04; C09J201/00
Domestic Patent References:
| WO2017038921A1 | 2017-03-09 |
Foreign References:
| JP2011129649A | 2011-06-30 | |||
| JP2013040333A | 2013-02-28 |
Other References:
See also references of EP 3442010A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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