Title:
ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2018/159591
Kind Code:
A1
Abstract:
Provided is an adhesive film having exceptional protective properties with respect to an object to be machined after laser machining. The adhesive film provided according to the present invention comprises a plastic film as a substrate and an adhesive agent layer provided to at least one surface of the substrate. The adhesive film satisfies the following conditions (A)-(D). (A) In a thermal shrinkage test of heating at 120°C for 10 minutes, both the thermal shrinkage rate SMD in a flow direction and the thermal shrinkage rate STD in a width direction are at least -2% and no more than 2%. (B) The high-speed peeling intensity measured at a peeling rate of 30 m/minute is at least 3 N/20 mm and no more than 20 N/20 mm. (C) In a constant load peeling test of applying a load of 30 g for 1 hour, the peeling distance is less than 50 mm. (D) The laser light absorption rate in a wavelength range of 1000-1100 nm is at least 20%.
Inventors:
HORIGUCHI HAKARU (JP)
YONEZAKI KOUSUKE (JP)
UKEI NATSUKI (JP)
HANAOKA MINORU (JP)
YONEZAKI KOUSUKE (JP)
UKEI NATSUKI (JP)
HANAOKA MINORU (JP)
Application Number:
PCT/JP2018/007188
Publication Date:
September 07, 2018
Filing Date:
February 27, 2018
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/20; B23K26/18; B23K26/38; C09J133/06; C09J201/00
Foreign References:
| JP2016196527A | 2016-11-24 | |||
| JP2013018964A | 2013-01-31 | |||
| JP2007039665A | 2007-02-15 | |||
| JP2013018963A | 2013-01-31 | |||
| JP2014005372A | 2014-01-16 |
Attorney, Agent or Firm:
OI, Michiko (JP)
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