Title:
ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2019/131923
Kind Code:
A1
Abstract:
One embodiment of the present invention provides an adhesive film comprising a first adhesive layer, a metal layer, and a second adhesive layer in said order, wherein the first adhesive layer and the second adhesive layer each contain first conductive particles which are dendritic conductive particles, and second conductive particles that are different from the first conductive particles, and that each have a non-conductive core and a conductive layer provided on the core.
Inventors:
SHIRAKAWA TETSUYUKI (JP)
IWAMOTO SHINNOSUKE (JP)
FUKUI TAKAHIRO (JP)
IWAMOTO SHINNOSUKE (JP)
FUKUI TAKAHIRO (JP)
Application Number:
PCT/JP2018/048285
Publication Date:
July 04, 2019
Filing Date:
December 27, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J7/28; B32B15/08; C09J9/02; C09J11/04; C09J11/08; C09J201/00; H01B1/00; H01B1/22; H01B5/00; H01B5/02
Domestic Patent References:
| WO2016190278A1 | 2016-12-01 | |||
| WO2014021037A1 | 2014-02-06 |
Foreign References:
| JP2016222748A | 2016-12-28 | |||
| JP2016048746A | 2016-04-07 | |||
| JP2009079127A | 2009-04-16 | |||
| JP2002324427A | 2002-11-08 | |||
| JP2016204687A | 2016-12-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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