Title:
ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/118825
Kind Code:
A1
Abstract:
Provided is an adhesive (11, 12) for high-frequency dielectric heating for joining at least three adherends (110, 120, 130). A dielectric property DP1 of the adhesive (11, 12) and a dielectric property DP2 of the respective adherends (110, 120, 130) satisfy expression (1). Each of the adherends (110, 120, 130) is an adherend with or without a flow starting temperature. A flow starting temperature TF2 (°C) of the adherends (110, 120, 130) and a flow starting temperature TF1 (°C) of the adhesive (11, 12) satisfy expression (2). The dielectric properties DP1 and DP2 are values of the dielectric property (tanδ / ε'r), tanδ and ε'r being respectively a dielectric loss tangent and relative permittivity at 23°C and a frequency of 40.68 MHz. (1): 0 < DP1 - DP2
(2): -5 ≤ TF2 - TF1
Inventors:
TAYA NAOKI (JP)
TSUCHIBUCHI KOJI (JP)
TSUCHIBUCHI KOJI (JP)
Application Number:
PCT/JP2021/043771
Publication Date:
June 09, 2022
Filing Date:
November 30, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B7/027; B32B27/18; C09J7/10; C09J7/30; C09J11/04; C09J201/00; H05B6/54
Domestic Patent References:
| WO2020203206A1 | 2020-10-08 | |||
| WO2018079354A1 | 2018-05-03 | |||
| WO2021200686A1 | 2021-10-07 |
Foreign References:
| JP2010006908A | 2010-01-14 | |||
| JP2020070365A | 2020-05-07 | |||
| JP2018177825A | 2018-11-15 | |||
| JP2014213524A | 2014-11-17 | |||
| JP2003252658A | 2003-09-10 | |||
| JPH11187626A | 1999-07-09 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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