ADHESIVE INJECTION METHOD, AND STRUCTURE - MITSUBISHI HEAVY IND LTD

Title:

ADHESIVE INJECTION METHOD, AND STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2018/096836

Kind Code:

A1

Abstract:

An adhesive injection method and a structure are provided which make it possible to confirm that no air bubbles remain in an adhesive injection region when injecting an adhesive, and which reduce air bubbles contained in the adhesive and decrease reduction in adhesive strength of a composite material. This injection method of an adhesive for adhering an outer plate and a reinforcement member involves a positioning step S12 for positioning the outer plate and the reinforcement member, a seal material arrangement step S14 for arranging a seal material that closes the gap between the outer plate and the reinforcement member, and an injection step S16 for injecting the adhesive into through-holes in the reinforcement member in order from one end to the other end of the adhesion plate. Specifically, in step S16, when injecting adhesive into the through-holes, at the stage when the adhesive can be seen from a hole adjacent to the current adhesive injection through-hole, the adhesive injection through-hole is changed from the current adhesive injection through-hole to the through-hole where the adhesive can be seen.

Inventors:

TAKAGI KIYOKA (JP)
ISHIDA JUN (JP)
KAMO SOTA (JP)
YOSHINO KATSUYA (JP)
KATO TETSUYA (JP)

Application Number:

PCT/JP2017/037419

Publication Date:

May 31, 2018

Filing Date:

October 16, 2017

Export Citation:

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Assignee:

MITSUBISHI HEAVY IND LTD (JP)

International Classes:

B29C65/52; B29C70/02

Foreign References:

JPH07507383A	1995-08-10
JPS6078131A	1985-05-02
JPS59212250A	1984-12-01

Other References: