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Patent Searching and Data


Title:
ADHESIVE LAMINATE
Document Type and Number:
WIPO Patent Application WO/2010/041667
Kind Code:
A1
Abstract:
Provided are adhesive laminates with which there is no adhesive residue even when polyester backing layers are used. The adhesive laminates comprise a polyester backing layer and an adhesive layer. One surface of the polyester backing layer has been treated to facilitate, and the adhesion layer is in contact with the treated surface. The adhesive layer is obtained by curing a curable composition comprising the following silyl group-containing polymer (S). The silyl group-containing polymer (S) is a silyl group-containing polymer that has a polyether chain, polyester chain and/or a polycarbonate chain in the main chain and a hydrolysable silyl group at the molecular end.

Inventors:
YASUDA TERUHIKO (JP)
SHIMOMA HITOSHI (JP)
SATO HISASHI (JP)
Application Number:
PCT/JP2009/067429
Publication Date:
April 15, 2010
Filing Date:
October 06, 2009
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (JP)
YASUDA TERUHIKO (JP)
SHIMOMA HITOSHI (JP)
SATO HISASHI (JP)
International Classes:
B32B27/36; C08G18/40; C08G18/83; C09J7/22; C09J7/35; C09J167/00; C09J169/00; C09J171/00; C09J175/04; C09J175/06; C09J175/08; C09J201/10
Domestic Patent References:
WO2006118766A12006-11-09
WO2005073333A12005-08-11
WO2005073334A12005-08-11
Foreign References:
JPS6032871A1985-02-20
JP2007231117A2007-09-13
JP2007001225A2007-01-11
JP2000230159A2000-08-22
JP2004217825A2004-08-05
JP2008261780A2008-10-30
JP2009057005A2009-03-19
Other References:
See also references of EP 2336260A4
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
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