Title:
ADHESIVE LAYERED BODY, METHOD FOR MANUFACTURING OBJECT TO BE PROCESSED WITH RESIN FILM, AND METHOD FOR MANUFACTURING HARDENED SEALING BODY WITH HARDENED RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2019/131408
Kind Code:
A1
Abstract:
Provided is an adhesive layered body comprising: a thermally expandable adhesive sheet (I) that includes a substrate (Y1) and an adhesive layer (X1), either of which contains thermally expandable particles; and a resin film forming sheet (II) that includes a substrate (Y2) and a hardening resin layer (Z2). The adhesive layered body is formed by directly layering the adhesive sheet (I) and the substrate (Y2) of the resin film forming sheet (II), and the adhesive layered body is used to secure an object to be processed to a support body when prescribed processing is performed thereon. The adhesive layered body is separable at an interface P between the adhesive sheet (I) and the substrate (Y2) of the resin film forming sheet (II) by heating treatment at the temperature of at least the thermal expansion start temperature (t) of the thermally expandable particles.
Inventors:
NAKAYAMA TAKEHITO (JP)
OKAMOTO NAOYA (JP)
AKUTSU TAKASHI (JP)
OKAMOTO NAOYA (JP)
AKUTSU TAKASHI (JP)
Application Number:
PCT/JP2018/046889
Publication Date:
July 04, 2019
Filing Date:
December 19, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/29; B32B7/06; B32B27/00; C09J11/00; C09J201/00
Domestic Patent References:
| WO2016076131A1 | 2016-05-19 |
Foreign References:
| JP2009035635A | 2009-02-19 | |||
| JP2000248240A | 2000-09-12 | |||
| JP2017002190A | 2017-01-05 | |||
| JP2007246848A | 2007-09-27 | |||
| JP2006245487A | 2006-09-14 | |||
| JP2003261842A | 2003-09-19 | |||
| JP2004266179A | 2004-09-24 | |||
| JPH06259017A | 1994-09-16 |
Attorney, Agent or Firm:
ARINAGA, Shun et al. (JP)
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