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Patent Searching and Data


Title:
ADHESIVE MATERIAL FOR EASY DISASSEMBLY, CURED OBJECT, ARTICLE, AND DISASSEMBLY METHOD
Document Type and Number:
WIPO Patent Application WO/2022/009513
Kind Code:
A1
Abstract:
Provided is an adhesive material for easy disassembly which combines satisfactory adhesion strength with suitability for easy disassembly. The adhesive material for easy disassembly comprises an epoxy resin and a polyaddition-type curing agent having a reactive group which reacts with the epoxy resin, wherein the epoxy resin and/or the curing agent includes an anthracene dimer skeleton.

Inventors:
SATO ERIKO (JP)
Application Number:
PCT/JP2021/017653
Publication Date:
January 13, 2022
Filing Date:
May 10, 2021
Export Citation:
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Assignee:
UNIV KYUSHU NAT UNIV CORP (JP)
International Classes:
C09J163/00; B32B27/38; C08G59/24; C09J5/00; C09J11/06
Domestic Patent References:
WO2009011421A12009-01-22
Foreign References:
CN110452103A2019-11-15
JPH11502250A1999-02-23
JP2010270022A2010-12-02
Other References:
AKIYAMA HARUHISA, OKUYAMA YOKO, FUKATA TAMAKI, KIHARA HIDEYUKI: "Reversible photocuring of liquid hexa-anthracene compounds for adhesive applications", THE JOURNAL OF ADHESION, vol. 94, no. 10, 2018, pages 799 - 813, XP055899289, ISSN: 0021-8464
KAISER S., RADL S. V., MANHART J., AYALUR-KARUNAKARAN S., GRIESSER T., MOSER A., GANSER C., TEICHERT C., KERN W., SCHLÖGL S.: "Switching ''on'' and ''of'' the adhesion in stimuli-responsive elastomers", SOFT MATTER, vol. 14, no. 13, 2018, pages 2547 - 2559, XP055899290
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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