ADHESIVE, METHOD FOR BONDING, AND ASSEMBLIES OF MOUNTED BOARDS

Title:

ADHESIVE, METHOD FOR BONDING, AND ASSEMBLIES OF MOUNTED BOARDS

Document Type and Number:

WIPO Patent Application WO/1998/051756

Kind Code:

A1

Abstract:

A two-part adhesive, characterized by being essentially composed of an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and being separated into agent (A) containing one or two components selected from among an acrylic monomer, a peroxide and a reducing agent and agent (B) containing the other components that have not been selected for agent (A). This adhesive can constantly give a highly reliable bonding which is free from heat stress and excellent in heat resistance.

Inventors:

DATE HIROAKI (JP)
MOTOYAMA YUKO (JP)
TOKUHIRA HIDESI (JP)
USUI MAKOTO (JP)
IMAIZUMI NOBUHIRO (JP)

Application Number:

PCT/JP1998/002082

Publication Date:

November 19, 1998

Filing Date:

May 11, 1998

Export Citation:

Click for automatic bibliography generation Help

Assignee:

FUJITSU LTD (JP)
DATE HIROAKI (JP)
MOTOYAMA YUKO (JP)
TOKUHIRA HIDESI (JP)
USUI MAKOTO (JP)
IMAIZUMI NOBUHIRO (JP)

International Classes:

C09J4/02; C09J5/06; C09J9/02; C09J163/00; H01L21/56; H01L21/60; C09J4/06; H05K1/03; H05K3/30; H05K3/38; (IPC1-7): C09J163/00; C09J4/02; C09J5/04; C09J5/06; H01B1/20; H01L21/52

Foreign References:

JPH07252460A	1995-10-03
JPH06322350A	1994-11-22
JPH05321920A	1993-12-07
JPH04100878A	1992-04-02
JPH0688040A	1994-03-29

Other References: