Title:
ADHESIVE AND MOLDED ARTICLE USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/132334
Kind Code:
A1
Abstract:
Provided is an adhesive that causes thermosetting resins and thermoplastic resins to heat efficiently and improves the adhesion of the adhesive to a resin or other such non-magnetic or insulating material, when bonding is performed using high-frequency induction heating. An adhesive used when forming a molded article by bonding a nonmetallic material and a nonmetallic material, wherein the adhesive contains a thermosetting resin and/or thermoplastic resin, and contains fibers having a conductor and/or magnetic material bonded to the fiber surface.
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Inventors:
HOJO FUSAO (JP)
ISHII TOSHIAKI (JP)
ISHII TOSHIAKI (JP)
Application Number:
PCT/JP2013/054932
Publication Date:
September 04, 2014
Filing Date:
February 26, 2013
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
C09J201/00
Foreign References:
| JP2007314711A | 2007-12-06 | |||
| JPS63245483A | 1988-10-12 | |||
| JPS63118391A | 1988-05-23 | |||
| JPS633430U | 1988-01-11 | |||
| JPS62132983A | 1987-06-16 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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