Title:
ADHESIVE FOR MOUNTING ELECTRONIC COMPONENT AND ADHESIVE FILM FOR MOUNTING FLIP CHIP
Document Type and Number:
WIPO Patent Application WO/2015/133386
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an electronic component mounting adhesive that can achieve sufficient solder bonding within a short mounting time while suppressing solder flow, that suppresses voids, and that has excellent reflow resistance. Another purpose of the present invention is to provide a flip chip mounting adhesive film that includes the electronic component mounting adhesive. The present invention is an electronic component mounting adhesive that contains: an acryl polymer that has a double bond equivalence of 1-5 meq/g and that has a methacryloyl group as a side chain; a polyfunctional methacrylate compound that has three or more functional groups; and a radical polymerization initiator.
Inventors:
WAKIOKA SAYAKA (JP)
Application Number:
PCT/JP2015/055764
Publication Date:
September 11, 2015
Filing Date:
February 27, 2015
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J133/04; C09J4/02; C09J7/10; C09J11/04; C09J11/06; C09J163/00; C09J163/10; H01L21/60
Foreign References:
| JP2012041540A | 2012-03-01 | |||
| JP2013028726A | 2013-02-07 | |||
| JP2009173796A | 2009-08-06 | |||
| JP2011029392A | 2011-02-10 |
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
Download PDF: