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Patent Searching and Data


Title:
ADHESIVE PREPARATION MANAGEMENT METHOD, ADHESIVE PREPARATION MANAGEMENT MODULE, AND ADHESIVE PREPARATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/169108
Kind Code:
A1
Abstract:
Provided is an adhesive preparation management method for managing an adhesive state of an adhesive preparation with respect to an individual which has a body temperature, said method comprising: a step (1) of adhering an adhesive preparation upon an individual; a step (2) of sensing a temperature change which is caused by the adhesive preparation being adhered upon the individual; and a step (3) of determining, on the basis of whether the temperature change has occurred, whether the adhesive preparation has been adhered upon the individual.

Inventors:
OKUMURA KEISUKE (JP)
YOSHIOKA RYOMA (JP)
Application Number:
PCT/JP2017/004007
Publication Date:
October 05, 2017
Filing Date:
February 03, 2017
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
A61M35/00; A61B5/01; A61K9/70; A61M37/00
Domestic Patent References:
WO2016041873A12016-03-24
Foreign References:
JP2012180348A2012-09-20
JPH04504000A1992-07-16
JPS58177847U1983-11-28
JPH08219898A1996-08-30
CN204520636U2015-08-05
JP2004008471A2004-01-15
JP2015056597A2015-03-23
Other References:
See also references of EP 3437690A4
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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