Title:
ADHESIVE PROCESSING LIQUID, METHOD FOR PRODUCING RECYCLED BASE MATERIAL USING ADHESIVE PROCESSING LIQUID, AND METHOD FOR PRODUCING RECYCLED POLYMER COMPOSITION USING ADHESIVE PROCESSING LIQUID
Document Type and Number:
WIPO Patent Application WO/2024/080125
Kind Code:
A1
Abstract:
The present invention provides an adhesive processing liquid which is capable of easily removing an adhesive, while having a low environmental impact. The present invention also provides a method for producing a recycled base material using an adhesive processing liquid, the method easily recovering a recycled base material from an adhesive tape, which comprises a base material and an adhesive, with use of the above-described adhesive processing liquid, the recycled base material being suppressed in contamination and corrosion. The present invention also provides a method for producing a recycled polymer composition, which can be a starting material for a recycled adhesive, with use of the above-described adhesive processing liquid. An adhesive processing liquid according to one embodiment of the present invention is used for the purpose of processing an adhesive, and contains water, an organic solvent and an alkali compound; and the organic solvent and the water form a phase-separated state.
Inventors:
KOTANI CHIHIRO (JP)
YAMAMOTO AKIYOSHI (JP)
YAMADA YOSUKE (JP)
YAMAMOTO AKIYOSHI (JP)
YAMADA YOSUKE (JP)
Application Number:
PCT/JP2023/034775
Publication Date:
April 18, 2024
Filing Date:
September 25, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J5/00; B29B17/02; C09J133/00; C11D7/04; C11D7/50
Domestic Patent References:
| WO2022004609A1 | 2022-01-06 |
Foreign References:
| JP2003292994A | 2003-10-15 | |||
| JPH10195492A | 1998-07-28 | |||
| KR20110018226A | 2011-02-23 | |||
| JP2021161331A | 2021-10-11 | |||
| JPH0641592A | 1994-02-15 | |||
| JP2004323841A | 2004-11-18 |
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
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