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Title:
ADHESIVE RESIN COMPOSITION, COVER LAY FILM, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2011/040194
Kind Code:
A1
Abstract:
An adhesive resin composition which contains a polyimide resin comprising group Ar (tetravalent aromatic group), group R1 (divalent diaminosiloxane residue), and group R2 (divalent aromatic diamine residue) and which has a P value of 0.7 or less, said P value indicating the content of polar groups in the composition and being a value calculated by numerical formula (i):  P value = {(A1 + A2)/(B1 + B2)} × 100 ∙∙∙∙∙ (i) [wherein A1 = (number of polar groups in group Ar) × (molar content of group Ar); A2 = (number of polar groups in group R2) × (molar content of group R2); B1 = (molecular weight of group Ar) × (molar content of group Ar); and B2 = (molecular weight of group R2) × (molar content of group R2), with the proviso that the number of polar groups of -X (halogen), -OH, -SH, -O-, -S-, -SO-, -NH-, -CO-, -CN, -P=O or -PO- is taken as 1, that of -SO2- or -CONH- is taken as 2, and that of -SO3H is taken as 3].

Inventors:
MORI AKIRA (JP)
SUTO YOSHIKI (JP)
NAKAMURA KOJI (JP)
Application Number:
PCT/JP2010/065403
Publication Date:
April 07, 2011
Filing Date:
September 08, 2010
Export Citation:
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Assignee:
NIPPON STEEL CHEMICAL CO (JP)
MORI AKIRA (JP)
SUTO YOSHIKI (JP)
NAKAMURA KOJI (JP)
International Classes:
C09J179/08; C09J183/10; H05K3/28
Foreign References:
JP2002121530A2002-04-26
JP2003105306A2003-04-09
JPH05200946A1993-08-10
JPH06346030A1994-12-20
JPH10212468A1998-08-11
JP2009029982A2009-02-12
Attorney, Agent or Firm:
WATANABE Kazuhiro et al. (JP)
Kazuhiro Watanabe (JP)
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